UFP 1001 - Application on Particle Board / Chipboard / MDF
UFP 1001 is a special form powder resin developed from liquid Urea Formaldehyde Resin. Since it's in powder form, UFP 1001 is easy to transport, giving more comfort to users coming from different islands or abroad. This product has a storage life of up to 12 months, unlike liquid Urea Formaldehyde Resin which only last for less than one month. It is very suitable for when production is not predictable.

UFP 1001 is also possible to be used in the assembly of high-grade furniture, edge-gluing, doweling, finger-jointing, and other similar woodworking operations. Besides plywood manufacturing, UFP 1001 can also be successfully adapted to the manufacture of particle board, chipboard, MDF, and the overlaying of decorative paper or veneers.

TECHNICAL SPECIFICATIONS

   *Note: Specifications can also be adjusted upon customer request.

  

CLEANING AND HANDLING

UFP 1001 Powder Resin glue mix is acidic in nature. DO NOT mix with Phenol Formaldehyde Resin for Water-Boil Proof grade plywood which is alkali in nature. If Phenol Formaldehyde Resin has been used in the glue mix before UFP 1001 Powder Resin, then the mix should be cleaned before changing into UFP 1001 Powder Resin.

UFP 1001 Powder Resin glue mix can be easily washed with normal or warm water. If cleaning is rather tough, use 10% Urea solution to help the process.

 

STORAGE

In its original container at 30°C temperature UFP 1001 Powder Resin  has a storage life of approximately 12 months. UFP 1001 Powder Resin should be stored in a cool and dry place away from direct sunlight, high temperature and high humidity. Heat and moisture will cause the powder to harden and become useless. Direct sunlight renders UFP 1001 unusable rapidly. Therefore it should not be stored in the open.

Once a container has been opened, the contents should be used up as soon as possible. On cases where there is left over powder, secure bag to avoid exposure to the environment. UFP 1001 Powder Resin should remain usable up to one year or longer. Maximum storage life is attained when UFP 1001 Powder Resin is stored under cool and dry conditions. The IWPH 101 can be kept for indefinite time as long as it is not exposed to humidity.

 

PACKAGING AND SHIPPING INFORMATION.

We at PT Intanwijaya Internasional Tbk produce our UFP 1001 Powder Resin in the following packages; 

 25kg

Packed in woven polypropylene bags (WWP bag) or paper bag carton with double inner polyethylene liner, heat seal

 18MT 20 FT Container
 
 

APPLICATION ON MANUFACTURE OF PARTICLE BOARD / CHIPBOARD / MDF 

Having the same ingredients as the liquid Urea Formaldehyde Resin, UFP 1001 Powder Resin can also meet the requirements as the bonding adhesive resin in manufacturing particle board, chipboard, or Medium Density Fiberboard (MDF).

 

TYPICAL PROPERTIES OF UFP 1001 POWDER RESIN

UFP 1001 is very suitable for particle vboard, chipboard and MDF manufacturing process because it has the following typical properties:

 pH value (50% solution) 
 : 7.5-8.5 
 Viscosity (50% solution) 
 : 100-200 CPS 

   

PREPARATION OF GLUE MIX - RECOMMENDED FORMULATION

Recommended glue mix for application on manufacture of particle board, chipboard or MDF is as follows;

 UFP 1001
: 100 parts by weight
 Water: 80 parts by weight
 Ammonium Chloride (20% solution) 
: 6 parts by weight
 Ammonium Hydroxide (25% solution) 
: 2 parts by weight

Note: The above recommended glue mix formula is only a general guide. For specific needs please refer to the enclosed graph.

 

ADDITIVES

To lower both the cost of the glue mix and formaldehyde emission, Urea can be added to the above recommended formulation, up to 10 parts by weight.

 

SPECIFICATIONS OF THE RECOMMENDED GLUE MIX

The above recommended formulation of glue mix will have the following specifications;

 Viscosity: 150 ± 25 CPS
 pH value
: 6.0-7.0
 Boiling water gelation 
: 100 ± 20 seconds
 Specific gravity (on room temperature)
: 1,230 ± 0.002
 Pot life (on room temperature) 
: > 4 hours

 

WAX EMULSION

Suitable wax emulsion can be used to improve water resistance and dimensional stability of the particle board and chipboard. The emulsifying agent can tolerate the mildly acidic nature of the above formulated glue mix. The usage is normally between 0.5-1% of resin solids to the chips' dry weight.

 

MOISTURE CONTENT OF THE PARTICLES

The particle is best to have Moisture Content of 3-5%. Too high of moisture content will make the pressing time longer. If the moisture content exceeds 8%, it's best if the material is avoided as particle board material, unless it's designed to be that way.

 

MIXING PROCEDURE

The glue mix of the above formulation should be mixed according to the following steps;

  1. Pour about 2/3 of the required water and start the mixer,
  2. Add in all parts of the resin while mixing until all lumps smooth out,
  3. Add the emulsifier (wax or ammonia) and other required additives,
  4. Slowly add all the hardener and the remaining of the required water, and mix on for 3 to 5 minutes. The glue mix is then ready to be sprayed or spread.

 

GLUE APPLICATION

The amount of glue mix to spray onto the chips varies between 6-10 % of resin solids to the chips' dry weight. In particle board, the resin content on the glue mix for the face chips should be more than that threshold, while for the core chips it should be less than the threshold.

The chips that has been spread with glue should not be left out too long before the hot press process, especially when the temperature is with drastic changes. To prevent pre-curing on the particle board, it's best to avoid the formation of warm areas inside it.

Pressing will have good results on temperatures between 140-200°C, with lower temperatures for daytime double-pressing and higher temperatures for daytime single press which needs shorter time.

The speed in stopping the press process affects the conditions of the resulted board. After the press time is achieved, pressing is stopped by reducing the pressure of the press machine so the vapors can slip away.

After that the board should be cooled at below 100°C or be arranged in packs which are not higher than 50 cm to avoid color fading and loosening of the bond because of over curing. To obtain a good humidity the board should be stacked for 2 or 3 days before subsequent handling.

 

COATING OF PARTICLES

The resin required for the coating of particles for particle board manufacture, calculated based on the particle's dry chip weight, is as follows;

 1-layer Particle board
 : about 8% resin solids
 3-layer Particle board 
- outer layers
: 11-13% resin solids
 - core
: 8-9% resin solids

 

HOT PRESS - TIME

Minimum hot press time can only be determined by practical trials because this time is very dependent to conditions of the chips' pH value, hardener used, press plate temperature, and also the thickness and specific gravity of the resulting particle board desired. As a general guide, it is recommended a 10 minutes time for 140°C temperature, and less than 5 minutes for temperatures of more than 180°C, on particle board of 18 mm thick with evenly spread specific gravity.

Based on it's thickness, hot pressing is done about 18-30 seconds/mm. This time should also be determined with practical trials because it depends on specific conditions of each thickness.

HOT PRESS - PRESSURE AND TEMPERATURE

I this application, the optimum pressure for hot press is 10-30 kg/cm2. The optimal temperature for hot press is 140-220°C.

 

FORMALDEHYDE EMISSION

With measurements according to the JAS standard it is found that the Formaldehyde emission of UFP 1001 is under 5 ppm.

PRODUCTS

Liquid Resin

Powder Resin

Formaldehyde

Bahasa Indonesia